GE VMIVME-7807RC Overview
The VMIVME-7807RC is a high-performance, 6U VMEbus single-board computer (SBC) based on the Intel® Pentium® III processor. It was designed for demanding real-time, industrial, and military/aerospace applications where reliability and processing power were critical.
Detailed Technical Specifications
1. Processor (CPU)
- Model: Intel® Pentium® III processor.
- Speed: Available in various clock speeds, commonly 700 MHz, 850 MHz, and 1.26 GHz.
- Front Side Bus (FSB): 100 MHz or 133 MHz, depending on the CPU speed.
- Cache: Integrated on-die 256 KB L2 advanced transfer cache.
2. Memory
- Type: PC133 SDRAM with Error Correction Code (ECC).
- Capacity: Typically equipped with 512 MB of RAM, soldered directly onto the board. Some variants may have been offered with 256 MB or up to 1 GB.
3. Architecture & Chipset
- Core Logic: Intel® 815E Chipset (Graphics and Memory Controller Hub + I/O Controller Hub).
- BIOS: Phoenix BIOS stored in Flash ROM, supporting Plug and Play.
4. VMEbus Interface
- Controller: Tundra Semiconductor (formerly Motorola) Universe II (Tsi148) VMEbus controller.
- Capabilities:
- Master, Slave, and System Controller capability.
- Supports A16, A24, and A32 address modes.
- Supports D8, D16, and D32 data modes.
- Supports BLT (Block Transfer), MBLT (Multiplexed Block Transfer), and 2eVME (2eSST) protocols for high-bandwidth data transfers.
- VME64 extension (5-row DIN connectors).
- Interrupts: Supports VMEbus IRQ1-IRQ7 and IACK daisy-chain handling.
5. Onboard I/O & Peripherals
- Ethernet: Two 10/100 Mbps Ethernet interfaces (10Base-T/100Base-TX) with RJ-45 connectors.
- USB: Two USB 1.1 ports.
- Serial: Four RS-232/422/485 serial ports (software-configurable). Often implemented with two ports on the front panel and two on the P2 connector.
- Parallel: One bidirectional IEEE 1284 parallel port.
- IDE: One EIDE (ATA-33/66) interface for connecting hard drives or CD-ROMs.
- Floppy: One floppy disk drive controller interface.
- SCSI: Many versions featured a built-in Ultra2/Narrow SCSI interface (LVD/SE).
- Keyboard/Mouse: PS/2-style keyboard and mouse connectors.
6. Graphics
- Controller: Integrated into the Intel® 815E chipset.
- Model: Intel® 1752 Graphics (based on the i754 design).
- Memory: Uses a portion of system main memory (UMA – Unified Memory Architecture), typically up to 8 MB.
- Output: Standard CRT (VGA) connector on the front panel.
- Performance: Suitable for text-based and 2D graphical user interfaces, not for high-end 3D applications.
7. Real-Time Support
- Timer: The Universe II controller provides a high-resolution, programmable timer.
- Watchdog Timer: A watchdog timer is included for monitoring software execution and triggering a reset on failure, a critical feature for embedded systems.
8. Mechanical & Environmental
- Form Factor: Standard 6U VME (233.35 mm x 160 mm).
- Cooling: Passive heatsink on the CPU, often with a mezzanine card for a dedicated fan for higher-speed CPUs. Relies on system airflow.
- Temperature:
- Commercial: 0°C to +55°C (with adequate airflow).
- Extended: Available in extended temperature range versions (e.g., -40°C to +85°C) for harsh environments.
9. Power Requirements
- Voltage: +5 V (primary power), ±12 V (for some interfaces).
- Typical Consumption: Approximately 15-25 Watts, depending on CPU speed and operational load.
10. Software Support
- Operating Systems: Was supported by a wide range of contemporary real-time and commercial operating systems:
- Real-time OS: VxWorks®, QNX®, LynxOS®, RTOS-32®.
- Unix: Solaris®, Linux (with appropriate drivers).
- Windows: Windows NT 4.0, Windows 2000, Windows XP Embedded.
Key Features & Applications
- High Integration: Combined powerful computing, extensive I/O, and robust VMEbus control on a single board, reducing system slot count.
- Rugged Design: Designed for reliability in industrial control systems.
- Legacy System Lifeline: These boards are often used as upgrade replacements for older, slower VMEbus SBCs (e.g., 486 or Pentium-based boards) to extend the life of critical machinery without redesigning the entire backplane and I/O system.
Typical Applications:
- Industrial Automation and Process Control
- Military and Aerospace Systems
- Telecommunications Infrastructure
- Data Acquisition and Signal Processing Systems
- Medical Imaging Equipment
Main Brand:
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High-Availability Parts Database (Top Demand Models)
1. Distributed Control System (DCS) Critical Components
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└─ Controller Card: SYSCON2 746924 (v2.3 Firmware)
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2. Programmable Logic Controller (PLC) Fast-Moving Parts
│
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3. Turbine Supervisory Instrumentation (TSI) Core Sensors
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├─ Bently Nevada 3500 System
├─ 3500/22M (Radial Vibration Monitor ｜ TÜV Certified)
└─ 3500/53 (Shaft Position Module ｜ ±1μm Precision)
│
├─ EPRO Smart Probe System
└─ MMS6312 (Vibration/Temperature Combo ｜ IP67 Rated)
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GE Company Introduction
General Electric Company (GE) is a renowned multinational conglomerate with diversified businesses spanning energy, aviation, healthcare, renewable energy, and digital industries. Below are its key details:
1. Company Overview
- Founded: 1892 (merger of Edison Electric Light Company and Thomson-Houston Electric Company)
- Headquarters: Boston, Massachusetts, USA
- Founders: Thomas Edison (technical pioneer), Charles Coffin (business integrator)
- Current CEO: Larry Culp (since 2018)
- Market Cap: ~$120 billion (2023 data, adjusted after spin-offs)
2. Core Business Segments
After strategic restructuring, GE now focuses on three main sectors:
- Aviation (GE Aerospace)
A global leader in aircraft engines and systems, including CFM International’s (joint venture with Safran) LEAP engines. - Healthcare (GE HealthCare)
Spun off in 2023, specializing in medical imaging, ultrasound, and life care equipment (e.g., CT, MRI machines). - Energy Transition (GE Vernova)
Launched in 2024, combining renewable energy (wind, hydro), gas power, and grid solutions.
3. Historical Milestones
- Early 1900s: Pioneered electrification, inventing the first commercial incandescent lamp and X-ray machine.
- 1970s: Entered aviation with the GE90 jet engine.
- Post-2008: Restructured after the financial crisis, divesting GE Capital.
- 2015-2020: Pushed digital transformation with the Predix industrial IoT platform.
- 2020s: Spun off non-core assets (e.g., appliances, biopharma) to focus on advanced manufacturing.
4. Presence in China
Since 1906, GE has contributed to projects like the Three Gorges Dam and COMAC C919, with multiple R&D and manufacturing sites (e.g., Beijing, Shanghai, Wuxi).
5. Recent Developments (2023-2024)
- Completed spin-offs of GE HealthCare and GE Vernova, leaving GE Aerospace as the remaining public entity.
- Accelerated sustainable tech R&D, including hydrogen-powered turbines and hybrid-electric aircraft engines.
6. Corporate Culture & Legacy
- Slogan: “Imagination at Work”
- Achievements: Holds numerous Nobel-level innovations and consistently ranks in the FortuneGlobal 500.
Through continuous transformation, GE aims to lead in low-carbon and high-tech industrial solutions.
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