2025年7月7日 BY
IN Company News
As semiconductors push for higher performance, 3D integration is key. 2.5D/3D packaging and heterogeneous integration are now mainstream. But they need better vertical interconnects and substrates. Enter glass substrates – and TGV (Through Glass Via) tech.
TGV: Beyond Silicon Limits
Silicon substrates have flaws. They struggle with high-frequency signals, cost too much, and have complex processes. Glass substrates, with TGV, fix these issues.

 

TGV is the vertical interconnect tech that makes glass substrates work for 3D integration. It’s set to lead the shift from “silicon-based” to “glass-based” packaging.
Advantages of TGV Over TSV
  • High-frequency excellence: Glass has a dielectric constant ~1/3 of silicon. Its loss factor is far lower. This reduces signal loss and keeps signals clear.
  • Cheaper production: Large ultra-thin glass is easy to source. No need for insulating layers on the substrate or TGV walls. Glass interposers cost ~1/8 of silicon ones.
  • Simpler steps: No need for complex insulation deposition. Ultra-thin interposers skip thinning. This speeds up production.
  • Stable structure: Even when thinner than 100μm, glass interposers warp little. This ensures packaging reliability.
  • Broad uses: It’s perfect for RF chips, high-end MEMS, and dense system integration. It’s a front-runner for next-gen high-frequency 3D packaging.

 

Ensuring TGV Quality with AOI Inspection
TGV is precise. Tiny flaws in any step can hurt yield and reliability. Issues include particles, scratches, uneven holes, or bad plating.
Human checks can’t catch these micro-flaws. So, AOI (Automated Optical Inspection) is critical. Companies like Huayi Ultra-Precision have developed AOI tools for TGV. They inspect every step – from glass prep to RDL – catching micron or even sub-micron flaws. This boosts yield and 工艺 optimization.
The Future of TGV
TGV’s maturity marks a shift to glass-based packaging. In 5-10 years, with better industry collaboration, it could see mass adoption. For China’s semiconductor sector, TGV offers a chance to lead in advanced packaging – making it a tech to watch.

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