AMAT PECVD P5000 MARK II
AMAT PECVD P5000 Mark II Overview
The AMAT P5000 Mark II PECVD is a classic plasma-enhanced chemical vapor deposition system from Applied Materials, widely used in 150 mm / 200 mm wafer fabs for dielectric and passivation film deposition. It belongs to the legendary Precision 5000 (P5000) platform — one of the most installed legacy deposition tools in semiconductor manufacturing.
What the P5000 Mark II Is
The P5000 Mark II is a single-wafer PECVD platform designed for high-volume manufacturing of dielectric thin films at relatively low temperatures using plasma-assisted deposition.
Typical users:
- IC fabs (legacy and specialty processes)
- MEMS / power semiconductor fabs
- GaN / SiC fabs using 200 mm lines
- Universities and R&D labs
The tool is still very popular on the secondary/refurbished market because of its reliability and process maturity.
Key Technical Features
Platform architecture
- Single-wafer cluster tool platform
- Loadlock + transfer robot
- Multiple process chambers supported
- Modular design for upgrades / retrofits
Typical wafer size
- 150 mm and 200 mm wafers
- Some systems upgraded for specialty substrates
Plasma PECVD capability
The system deposits films using RF plasma to activate gases at lower temperatures than thermal CVD.
Typical temperature range:
- ~200 °C – 450 °C (process dependent)
Typical Films Deposited
The P5000 Mark II PECVD is mainly used for dielectric and passivation layers.
Common films:
- Silicon nitride (SiN)
- Silicon dioxide (SiO₂ / TEOS)
- Oxide/nitride stacks
- Oxynitride (SiON)
- Low-temperature passivation films
- Interlayer dielectric (ILD)
- Protective coatings for MEMS and power devices
Applications:
- Interconnect dielectric layers
- Passivation layer for ICs
- Final chip packaging layers
- Optical and MEMS coatings
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