Lam Research 16-LINE IGS GAS BOX 571-033051-002 571-033051-10918B1 — Overview

Industrial Gas Delivery Module for Semiconductor Etch Systems

The Lam Research 16-Line IGS Gas Box 571-033051-002 is a high-precision integrated gas supply (IGS) module designed for semiconductor etch and deposition tools. This gas box provides stable, safe, and accurate delivery of multiple process gases, supporting advanced plasma etching and wafer fabrication environments.

Overview

The 16-line IGS Gas Box is part of Lam Research’s gas distribution architecture used in semiconductor manufacturing equipment. It integrates mass flow control, pressure monitoring, filtration, and safety interlocks into a single enclosure to ensure precise gas delivery and contamination control.

This assembly is typically installed in Lam etchers and plasma processing systems where accurate multi-gas mixing and rapid switching are required.

Key Features

Multi-Gas Delivery Capability

• Supports up to 16 independent gas lines
• Designed for complex semiconductor process recipes
• Enables fast gas switching and stable flow control

Integrated Mass Flow Control

Commonly equipped with multiple MFC types for different gases:

• D519MG MFC units
• SEC-Z313M MFC modules
• D219-SCT flow controllers
  These components allow precise flow regulation for process gases.

High-Reliability Valve & Solenoid Network

Typical configuration includes:

• Up to 96 solenoid valves
• VV100 and V110 series valve assemblies
• Designed for rapid response and long-life operation

Advanced Pressure Monitoring

Includes:

• Pressure switches (PS100 series)
• High-accuracy pressure transducers (2271Z02 series)

This ensures safe gas pressure regulation and real-time monitoring.

Contamination Control

• Integrated gas filtration modules
• High-purity gas compatibility
• Designed for cleanroom semiconductor environments

Typical Applications

The 16-Line IGS Gas Box is widely used in:

• Plasma etching systems
• Reactive Ion Etching (RIE) tools
• Semiconductor wafer fabrication lines
• Advanced materials processing
• Dry etch and deposition processes

The module enables distribution of gases such as:

• Argon (Ar)
• Oxygen (O₂)
• Nitrogen (N₂)
• Sulfur hexafluoride (SF₆)
• Chlorine (Cl₂)
• Fluorocarbon gases

These gases are essential for plasma generation and etching processes.

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